Product Name：Micro SD Conn. Push/ Push NORMAL SUPER-SMALL TYPE
Part No：TFJMF-108 XX BT0 X


Net Weight: 0.33 g
Packing: 1: Tape & Reel：1900 pcs/Reel; 8 Reels /carton 
 
APPLICATION:
       1. Notebook PC
       2. Digital camera
       3. Mobile phone


Pitch: 1.1mm
Number of port: 1
Circuits: 8


SPECIFICATION: 
     Electrical:
               1. Contact resistance: Contact: Initial Value 100 mΩ MAX.
               2. Insulation resistance: >1000 megaohms/ 500 VDC
               3. Withstanding Voltage: 500V AC rms 1 minute
               4. Operation: Normally open
     Environmental:
               Operating temperature: -25℃ ~ 85℃
     MATERIAL:
               1. Insulation material: High Temperature Plastic (UL94V-0)
               2. Contact material: Copper Alloy.


PRODUCT FEATURES: The world's thinnest mobile phones memory card.